BD241B DATASHEET PDF

BD, BDA, BDB, BDC. NPN SILICON POWER TRANSISTORS. PRODUCT INFORMATION. 1. JUNE – REVISED MARCH Copyright. Silicon NPN Power Transistors. BD/A/B/C. DESCRIPTION. ·With TOC package. ·Complement to type BD/A/B/C. APPLICATIONS. ·For medium power. BDB datasheet, BDB pdf, BDB data sheet, datasheet, data sheet, pdf, Boca Semiconductor Corporation, COMPLEMENTARY SILICON PLASTIC.

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BDC (Power Innovations) – NPN SILICON POWER TRANSISTORS | eet

Pin 2 is in electrical contact with the mounting base. Search field Part name Part description. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Documents Flashcards Grammar checker. Life support devices or systems are devices or 2. Information is current as of publication date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

The datasheet is printed for reference information only. The centre pin is in electrical contact with the mounting tab. Operating junction temperature range. This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. TO 3-pin plastic flange-mount package.

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BD241 Datasheet, Equivalent, Cross Reference Search

Mounting tab corner profile according to package version. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Unclamped inductive load energy see Note 4. Junction to free air thermal resistance. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.

These be241b must be measured using voltage-sensing contacts, separate from the current carrying contacts.

Specifications may change in any manner without notice. These parameters must be measured using pulse techniques, t.

A critical component is any component of a life support device or system whose failure to perform can systems which, a are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or b support or sustain life, or c whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness.

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Junction to case thermal resistance.

The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions.

High Speed Switching Transistors. Peak collector current see Note 1. This value applies for t. Voltage and current values shown are nominal; exact values vary slightly with transistor parameters. This rating is based on the capability of the transistor to operate safely in a circuit of: Leads require no additional cleaning or processing when used in soldered assembly.

Typical fixing hole centre stand off height according to package version. Production processing does not necessarily include testing of all parameters.